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A novel GAAC FinFET transistor: device analysis, 3D TCAD simulation, and fabrication

Xiao Deyuan Wang Xi Yuan Haijiang Yu Yuehui Xie Zhifeng Chi Minhwa

半导体学报2009,Vol.30Issue(1):014001-1-014001-5,2.
半导体学报2009,Vol.30Issue(1):014001-1-014001-5,2.DOI:10.1088/1674-4926/30/1/014001

A novel GAAC FinFET transistor: device analysis, 3D TCAD simulation, and fabrication

A novel GAAC FinFET transistor: device analysis, 3D TCAD simulation, and fabrication

Xiao Deyuan 1Wang Xi 2Yuan Haijiang 1Yu Yuehui 3Xie Zhifeng 1Chi Minhwa4

作者信息

  • 1. Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
  • 2. Semiconductor Manufacturing International Shanghai Corporation, Shanghai 201203, China
  • 3. Synopsys Inc,Shanghai200050,China
  • 4. Semiconductor Manufacturing International(Shanghai)Corporation,Shanghai 201203,China
  • 折叠

摘要

Abstract

We report the analysis and TCAD results of a gate-all-around cylindrical (GAAC) FinFET with operation based on channel accumulation. The cylindrical channel of the GAAC FinFET is essentially controlled by an infinite number of gates surrounding the cylinder-shaped channel. The symmetrical nature of the field in the channel leads to improved electrical characteristics, e.g. reduced leakage current and negligible corner effects. The Ion/Ioff ratio of the device can be larger than 106, as the key parameter for device operation. The GAAC FinFET operating in accumulation mode appears to be a good potential candidate for scaling down to sub-l0 nm sizes.

关键词

accumulation mode/ GAAC FinFET/ device analysis/ TCAD simulation/ fabrication

Key words

accumulation mode/ GAAC FinFET/ device analysis/ TCAD simulation/ fabrication

分类

信息技术与安全科学

引用本文复制引用

Xiao Deyuan,Wang Xi,Yuan Haijiang,Yu Yuehui,Xie Zhifeng,Chi Minhwa..A novel GAAC FinFET transistor: device analysis, 3D TCAD simulation, and fabrication[J].半导体学报,2009,30(1):014001-1-014001-5,2.

半导体学报

OA北大核心CSCDCSTPCDEI

1674-4926

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