半导体学报2001，Vol.22Issue(1)：107-112,6.
倒装焊SnPb焊点热循环失效和底充胶的影响
Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material
陈柳 1张群 1王国忠 1谢晓明 1程兆年1
作者信息
- 1. 中国科学院上海冶金研究所电子封装联合实验室
- 折叠
摘要
Abstract
The thermal cycle lifetimes of SnPb solder joints for flip chip package were determined experimentally.With viscoplastic and viscoelastic materials representing the mechanical behavior of SnPb solder and underfill,respectively,the stress/strain responses of SnPb solder joints under thermal cycling with finite element method are simulated.Based on the calculated plastic strain ranges and the experimental thermal cycle lifetimes,the material constants in Coffin-Manson empirical equation were then obtained.The results show that,the plastic strain ranges of solder joints with underfill decrease distinctly and the thermal cycle lifetimes are approximately 20 times larger than that in the case without underfill.Moreover,the influences of solder joint height on solder joint reliability are weakened for the flip chip package with underfill.关键词
倒装焊/SnPb焊点/底充胶/热循环/有限元模拟分类
信息技术与安全科学引用本文复制引用
陈柳,张群,王国忠,谢晓明,程兆年..倒装焊SnPb焊点热循环失效和底充胶的影响[J].半导体学报,2001,22(1):107-112,6.
