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Effect of pulse magnetic field on solidification structure and properties of pure copper

LIAO Xi-liang GONG Yong-yong LI Ren-xing CHEN Wen-jie ZHAI Qi-jie

中国铸造2007,Vol.4Issue(2):116-119,4.
中国铸造2007,Vol.4Issue(2):116-119,4.

Effect of pulse magnetic field on solidification structure and properties of pure copper

Effect of pulse magnetic field on solidification structure and properties of pure copper

LIAO Xi-liang 1GONG Yong-yong 2LI Ren-xing 1CHEN Wen-jie 1ZHAI Qi-jie1

作者信息

  • 1. School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China
  • 2. School of Mechanical Engineering,Shandong University, Jinan 250061, China
  • 折叠

摘要

Abstract

The application of pulse magnetic field to metal solidification is an advanced technique which can remarkably refine solidification structure. In this paper, the effect of pulse magnetic field on solidification structure,mechanical properties and conductivity of pure copper was experimentally investigated. The results showed that the solidification structure transformed from coarse columnar crystal to fine globular crystal with increasing pulse voltage.Increasing pulse voltage also improved the tensile strength. However, with the increase of pulse voltage, the elongation and electrical resistivity firstly decreased, then increased when the pulse voltage beyond a critical value. Moreover,in some conditions, pulse magnetic field can simultaneously improve the conductivity and mechanical property of pure copper.

关键词

pure copper/pulse magnetic field/solidification structure/property

Key words

pure copper/pulse magnetic field/solidification structure/property

分类

矿业与冶金

引用本文复制引用

LIAO Xi-liang,GONG Yong-yong ,LI Ren-xing ,CHEN Wen-jie ,ZHAI Qi-jie..Effect of pulse magnetic field on solidification structure and properties of pure copper[J].中国铸造,2007,4(2):116-119,4.

基金项目

The projects was supported by the Pre-research Foundation of the National Basic Research Program (973 Program, grant No.2004CCA07000) and the Science and Technology Committee of Shanghai Municipality (Grant No. 04XD14008). (973 Program, grant No.2004CCA07000)

中国铸造

OASCI

1672-6421

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