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Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer

Zhang Zhenlong Liu Xiangyang Mao Yanli

半导体学报2009,Vol.30Issue(9):135-138,4.
半导体学报2009,Vol.30Issue(9):135-138,4.DOI:10.1088/1674-4926/30/9/096001

Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer

Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer

Zhang Zhenlong 1Liu Xiangyang 1Mao Yanli1

作者信息

  • 1. Institute of Optics and Photoelectronic Technology, School of Physics and Electronics, Henan University, Kaifeng 475004, China
  • 折叠

摘要

Abstract

noise.

关键词

planar patch-clamp substrate/silicon-on-insulator/access resistance/capacitance

Key words

planar patch-clamp substrate/silicon-on-insulator/access resistance/capacitance

分类

信息技术与安全科学

引用本文复制引用

Zhang Zhenlong,Liu Xiangyang,Mao Yanli..Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer[J].半导体学报,2009,30(9):135-138,4.

半导体学报

OA北大核心CSCDCSTPCDEI

1674-4926

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