光学精密工程2009，Vol.17Issue(6)：1361-1366,6.
力平衡式真空微电子加速度传感器的机电耦合特性
Electromechanical coupling characteristics for force-balanced vacuum microelectronic accelerometer
摘要
Abstract
The inertia sensitive component of a force-balanced vacuum microelectronic accelerometer is effected by both the elastic force and the electrostatic force,and its total stiffness is the sum of the mechanical stiffness of the beams and the equivalent stiffness produced by the electrostatic force. In considerasion of the effect of emitting tip array, this paper introduces a revised constant αgreater than 1tocompute the actual electrostatic force by using the model of a parallel plate capacitor. The analysis shows that the linearity and sensitivity of the vacuum microelectronic accelerometer has been improved by increasing preload deflection voltages, so the stiffness and damping ratio of the system can be adjusted by modulating the voltage between the two deflection electrodes. Considering the affect by a pull-in, the displacement of proof mass must be less than one-third of the original distance between two deflection electrodes. Moreover,in order to obtain good dynamic characteristics, an optimum working point determined by the preload deflection voltage must be set. The experimental results show that the nonlinearity and sensitivity of the accelerometer are 0.95% and 557 mV/g when the deflection voltage and the emission voltage are 5.478 V and 1.953 V, respectively,which indicates that the sensor has good performance.关键词
机电耦合/力平衡/真空微电子/加速度传感器Key words
electromechanical coupling/force balance/vacuum microelectronics/accelerometer分类
信息技术与安全科学引用本文复制引用
杨银川,李东玲,尚正国..力平衡式真空微电子加速度传感器的机电耦合特性[J].光学精密工程,2009,17(6):1361-1366,6.基金项目
Supported by the National Natural Science Foundation of China(Grant No.60706032) （Grant No.60706032）
the NationalHi-Tech Research and Development Program of China(863 Program)(Grant No.2008AA04Z310) （863 Program）
the Cultivation Fund of the Key Scientific and Technical Innovation Project, Ministry of Education of China (Grant No. 708072) （Grant No. 708072）
