国际设备工程与管理（英文版）2008，Vol.13Issue(3)：148-153,6.
A Novel Approach for Micro-electro-mechanical System (MEMS) Vacuum Packaging
A Novel Approach for Micro-electro-mechanical System (MEMS) Vacuum Packaging
摘要
Abstract
MEMS vacuum packaging is now the impedimeut of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process cannot meet the requirement of the ultra low leak. But the process cannot be improved with the existing technology. We propose a novel approach for MEMS vacuum packaging which can remarkably lower the leak rate. This paper analyzed the vacuum maintaining time of the vacuum packaging and compared the current design and new packaging method.关键词
vacuum packaging/leak rate/vacuum maintenanceKey words
vacuum packaging/leak rate/vacuum maintenance分类
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WANG Cheng-gang,GAN Zhi-yin,WANG Xue-fang,LIN Dong,LIU Sheng,ZHANG Hong-hai..A Novel Approach for Micro-electro-mechanical System (MEMS) Vacuum Packaging[J].国际设备工程与管理（英文版）,2008,13(3):148-153,6.基金项目
This paper is supported by the High-tech Research and Development Program of China under Grant No.2005AA404260 （）
