中国机械工程2009，Vol.20Issue(14)：1731-1735,5.
单晶硅线锯切片亚表层损伤层厚度预测与测量
Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing
摘要
Abstract
An abrasive machining in wire sawing process was considered as moving indention sub-jected to normal force and tangential force. Based on indentation fracture mechanics theory,the calcula-tion formula of median crack propagation length was analyzed by synthetically considering the contri-butions of elastic stress field and residual stress field beneath the abrasive. The depth of median crack propagation layer was postulated as equal as to the subsurface damage layer thickness (dSSD),and the lateral crack depth was equal to the surface roughness Rz, thereby a theoretical model of relationship between dSSD and Rz was founded for predicting the dSSD. Moreover,a bonded interface sectioning tech-nique with scanning electron microscope(SEM) was employed to measure the silicon dSSD. The results indicate that the experimental measurement values coincide with the theoretical prediction ones com-paratively. The theoretical model can be used for predicting dSSD rapidly,expediently and accurately.关键词
线锯/单晶硅/亚表面损伤/表面粗糙度/裂缝Key words
wire saw/ monocrystalline silicon/ subsurface damage/ surface roughness/ crack分类
化学化工引用本文复制引用
高玉飞,葛培琪,李绍杰,侯志坚..单晶硅线锯切片亚表层损伤层厚度预测与测量[J].中国机械工程,2009,20(14):1731-1735,5.基金项目
国家自然科学基金资助项目(50475132) （50475132）
