航空材料学报2001，Vol.21Issue(1)：18-22,5.
Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制
TLP diffusion bonding of Si3N4 ceramics using Ti/Ni/Ti multilayer and controlling of joints＇ quality
摘要
Abstract
TLP diffusion bonding of Si3 N4 ceramics with Ti/Ni/Ti multilayer was investigated. The existing time of Ni-Ti transient liquid phase is short, and the strength of the interface formed within this duration is very low. The formation of strong joints needs further solid-state diffusion reaction, and its microstructures is Si3N4/TiN/TisSi3 + TisSi4 + Ni3Si/NiTi/Ni3Ti/Ni. The joints＇ strength is affected by bonding parameters, which include bonding time、bonding temperature、bonding presssure、thickness of Ti or Ni. The shear strength of joints at room temperature and 800℃ could reaches 142MPa and 61MPa, respectively.关键词
TLP扩散连接/Si3N4陶瓷/高温强度分类
矿业与冶金引用本文复制引用
邹贵生,吴爱萍,任家烈,李盛,任维佳..Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制[J].航空材料学报,2001,21(1):18-22,5.基金项目
国家自然科学基金项目(596750056) （596750056）
