北京科技大学学报2000，Vol.22Issue(3)：235-237,3.
大面积无衬底自支撑金刚石厚膜沉积
Preparation of Large Area Free Standing Thick Diamond Wafers
摘要
Abstract
Technical problems encountered in the preparation of large area free standing thick diamond films are discussed. Cracking of deposited diamond wafers is mainly due to the huge thermal stress resulted from the big difference in linear expansion coefficients between diamond and the Mo substrate. While the status of the surface preparation of the substrate, the control and optimization of process parameters are also very important. In order to obtain crack free large area thick diamond wafers it is necessary to strictly control the every step of the whole deposition process.关键词
自支撑金刚石厚膜/大面积/直流电弧等离子体喷射 CVDKey words
the free standing thick diamond films/large area/DC arc plasma jet CVD分类
通用工业技术引用本文复制引用
黄天斌,刘敬明,钟国仿,唐伟忠,佟玉梅,吕反修..大面积无衬底自支撑金刚石厚膜沉积[J].北京科技大学学报,2000,22(3):235-237,3.基金项目
国家863计划资助项目（No.715-002-Z030) （）
