中国电子科技2006，Vol.4Issue(1)：24-28,5.
Research on Crucial Manufacturing Process of Rigid-Flex PCB
Research on Crucial Manufacturing Process of Rigid-Flex PCB
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作者信息
- 1. School of Microelectronics and Information Engineering, University of Electronic Science and Technology of China Chengdu 610054 China;School of Microelectronics and Information Engineering, University of Electronic Science and Technology of China Chengdu 610054 China;Zhuhai Topsun Electric Technology Co., LTD. Zhuhai 519060 Guangdong China;Zhuhai Topsun Electric Technology Co., LTD. Zhuhai 519060 Guangdong China;Zhuhai Topsun Electric Technology Co., LTD. Zhuhai 519060 Guangdong China;College of chemistry and Environment Protection Engineering, Southwest University for Nationalities Chengdu 610041 China
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摘要
Abstract
The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board (PCB) is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.关键词
Printed Circuit Borad (PCB)/rigid-flex PCB/manufacturing process/plasma desmear processKey words
Printed Circuit Borad (PCB)/rigid-flex PCB/manufacturing process/plasma desmear process分类
信息技术与安全科学引用本文复制引用
..Research on Crucial Manufacturing Process of Rigid-Flex PCB[J].中国电子科技,2006,4(1):24-28,5.
