临床医学工程2009，Vol.16Issue(7)：26-27,2.
牙本质表面处理对半导体激光治疗牙本质过敏症疗效影响的研究
A Study on Effects of Superficial Treatment to Dentin on Curative Effect of Semiconductor Laser for Treatment of Hypersensitivity of the Dentin
谢显能1
作者信息
- 1. 武警福建省边防总队医院口腔科,福建,泉州,362000
- 折叠
摘要
Abstract
Objective The purpose of this study is to explore the effects of superficial treatment to dentin on curative effect of Semi-conductor Laser for treatment of Hypersensitivity of the dentin by clinical test and SEM obsevation, in order to find out the best of way Semi-conductor Laser for treatment of Hypersensitivity of the dentin to be applied. Methods 256 sensitive teeth in 111 patients were divided into 3 groups randomly, the teeth in group A were treated with Semiconductor Laser irradiate directly, but the teeth in group B and group C were treated with dentin cleanser or acid etching agent for 30 s respectively, prior to being treated with Semiconductor Laser, curative effects of 3 groups were compared with each other immediately and in three months(ehi-square test). In addition, models of dentin hypersensitivity were re-produced and the superficial morphoiogic change of denitn treated with dentin cleanser or acidetehing agent was observed by SEM. Results The immediately effective rates of grouop B and group C were significantly hingher than that of group A (P<0.01), and there were no statisti-cally significant differences between these two groups (P>0.05); in three months, the results were alike. The smear layer covening dentin sur-face could be cleaned completely after dentin was treated with denin cleanser or acid etching agent for 30 s, but demineralization would come into being after acid etching agent was applied. Conclusion The curative effect could be strengthened by treating the dentin surface for 30 s with the dentin hypersensitizer of Semiconductor Laser.关键词
牙本质过敏症/半导体激光/扫描电镜Key words
Dentin hypersensitiveness/Semiconductor laser/Scanning electron microseope(SEM)分类
医药卫生引用本文复制引用
谢显能..牙本质表面处理对半导体激光治疗牙本质过敏症疗效影响的研究[J].临床医学工程,2009,16(7):26-27,2.
