热科学学报（英文版）2009，Vol.18Issue(3)：268-275,8.DOI:10.1007/s11630-009-0268-1
Thermal Analysis of a Phase Change Material Based Heat Sink for Cooling Protruding Electronic Chips
Thermal Analysis of a Phase Change Material Based Heat Sink for Cooling Protruding Electronic Chips
Mustapha FARAJI 1Hamid EL QARNIA 1El Khadir LAKHAL2
作者信息
- 1. Fluids Mechanic and Energetic Laboratory
- 2. Automatic, Environment and Transfer Process Laboratory, Cadi Ayyad University, Faculty of Sciences Semlalia, Department of Physics P. O. Box 2390, Marrakech, Morocco
- 折叠
摘要
Abstract
iquid fraction were derived.关键词
Phase change material/protruding electronic component/natural convectionKey words
Phase change material/protruding electronic component/natural convection引用本文复制引用
Mustapha FARAJI,Hamid EL QARNIA,El Khadir LAKHAL..Thermal Analysis of a Phase Change Material Based Heat Sink for Cooling Protruding Electronic Chips[J].热科学学报（英文版）,2009,18(3):268-275,8.
