首页|期刊导航|哈尔滨工业大学学报（英文版）|Simulation and analysis of effects of Young's modulus of isolation material on natural frequencies of the sensor package and displacement of the chip
哈尔滨工业大学学报（英文版）2005，Vol.12Issue(3)：295-299,5.
Simulation and analysis of effects of Young's modulus of isolation material on natural frequencies of the sensor package and displacement of the chip
Simulation and analysis of effects of Young's modulus of isolation material on natural frequencies of the sensor package and displacement of the chip
摘要
Abstract
For the first time an anti-shock packaging model of an acoustic-vibration sensor system has been designed by using the shocking isolation principle. The finite element analysis has been applied for design and simulation of the model. The effects of Young's modulus of anti-shock rubber on naturally occurring frequencies of the combination of rubber and an acoustic sensor chip were analyzed. The displacement of the acoustic sensor chip is loaded with force. The results of static analysis and harmonic analysis show that while increasing Young's modulus of anti-chock rubber, the first five natural frequencies of the package body also increases. Yet the displacement of the acoustic sensor chip around the resonant frequency decreases. The results of static and transient analysis show that the displacement of the acoustic sensor chip decreases with the increase of Young's modulus of anti-chock rubber being loaded with either transient force or static force at the bottom of the combination of rubber and acoustic sensor chip.关键词
sensor packaging/shock isolation/anti-shock rubber/finite element analysisKey words
sensor packaging/shock isolation/anti-shock rubber/finite element analysis分类
信息技术与安全科学引用本文复制引用
YIN Jing-hua,LV Guang-jun,LIU Xiao-wei,LEI Qing-quan..Simulation and analysis of effects of Young's modulus of isolation material on natural frequencies of the sensor package and displacement of the chip[J].哈尔滨工业大学学报（英文版）,2005,12(3):295-299,5.基金项目
Sponsored by the Creativity Ability Fund Project for Cadreman of General Provincial University of Heilongjiang( Grant No. 1053G033 ). （ Grant No. 1053G033 ）
