电子器件2009，Vol.32Issue(2)：357-360,4.
热效应致RLC互连延时变化研究
Research on RLC Interconnect Delay Variation Induced by Thermal Effects
摘要
Abstract
Analysis of RIC interconnect delay increase induced by thermal effects is presented.A tempera-ture-dependent RLC interconnect delay model is proposed.The model is applied to quantify the impact of thermal effects on interconnect delay.Results show that for each 20℃increase in temperature there is roughly a 5 tO 6 percent increase in the delay for the RLC interconnect.关键词
RLC互连/延时/热效应/增加Key words
RIC interconnect/delay/thermal effects/increase分类
信息技术与安全科学引用本文复制引用
董刚,徐如清,杨银堂..热效应致RLC互连延时变化研究[J].电子器件,2009,32(2):357-360,4.基金项目
Proiect supported by the National Natural Science Foundation of China(60606006) （60606006）
