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熔融Cu55团簇在铜块体中凝固过程的分子动力学模拟

徐送宁 张林 张彩碚 祁阳

物理学报2009,Vol.58Issue(z1):40-46,7.
物理学报2009,Vol.58Issue(z1):40-46,7.

熔融Cu55团簇在铜块体中凝固过程的分子动力学模拟

Molecular dynamics simulations of a molten Cu55 cluster embedded in face-centred cubic bulk during solidification

徐送宁 1张林 2张彩碚 2祁阳2

作者信息

  • 1. 沈阳理工大学理学院,沈阳,110168
  • 2. 东北大学理学院,沈阳,110004
  • 折叠

摘要

Abstract

The structural evolution of a molten Cu55 cluster embedded in face-centred cubic (FCC) bulk is simulated by molecular dynamics method based on the embedded-atom method potential through mean square displacement, pair analysis indices, and the average energy of atoms. The simulated results show that final structure of the embedded Cu55 cluster mainly presents local FCC structure at the quenching temperatures. During solidification, the atoms continuously interchange their positions, and the rearrangement of atom positions is sensitive to the temperature change. As the quenching temperature increases, diffusion abilities of the atoms increase. At 100-500 K, the formed FCC structures are stable, whereas at 700-1100 K, the local structures of the clusters fluctuate with time step increasing.

关键词

团簇/分子动力学/计算机模拟/凝固

Key words

cluster/molecular dynamics/computer simulation/solidification

分类

数理科学

引用本文复制引用

徐送宁,张林,张彩碚,祁阳..熔融Cu55团簇在铜块体中凝固过程的分子动力学模拟[J].物理学报,2009,58(z1):40-46,7.

基金项目

国家自然科学基金(批准号:50572013)和国家重点基础研究发展计划(批准号:G2006CB605103)资助的课题. Project supported by the National Natural Science Foundation of China (Grant No. 50572013) and the State Key Development Program for Basic Research of China (Grant No. G2006CB605103). (批准号:50572013)

物理学报

OA北大核心CSCDCSTPCDSCI

1000-3290

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