材料工程Issue(5)：57-62,6.
Study on Cure Behavior of a Model Epoxy System by Means of TTT Diagram
Study on Cure Behavior of a Model Epoxy System by Means of TTT Diagram
摘要
Abstract
Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper.Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model.The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0, gel Tgand Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.关键词
epoxy resin/cure behavior/TTT diagramKey words
epoxy resin/cure behavior/TTT diagram分类
通用工业技术引用本文复制引用
ZHANG Ming,AN Xue-feng,TANG Bang-ming,YI Xiao-su..Study on Cure Behavior of a Model Epoxy System by Means of TTT Diagram[J].材料工程,2006,(5):57-62,6.基金项目
The work was supported by National Basic Research Program (the 973 program) under the grant No. of 2003CB615604, and the NNSF Key Basic Research Project under the grant No. of 10590356. （the 973 program）
