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粉末法制取钼铜合金的微观结构

何忠

材料科学与工程2000,Vol.18Issue(4):75-77,91,4.
材料科学与工程2000,Vol.18Issue(4):75-77,91,4.

粉末法制取钼铜合金的微观结构

Microstructure of the Active Sintered Mo-Cu Alloy

何忠1

作者信息

  • 1. 铁道部科学研究院金属及化学研究所,北京 100081
  • 折叠

摘要

Abstract

The micro-structural evolution in Mo-Cu alloy has been investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Mo-Cu alloy was made through liquidphase sintering of powders of Mo and Cu milled by mechanical activation,which is used for heat dissipation in high performance microelectronic circuits. The micro-structural characterization of Mo-Cu alloy is homogeneous compound structure of adhesive phase Cu linked with Mo grains. Mo grains frequently string together. There is little ellipsoidal Mo grains singly existed around by Cu phase. Between Mo grains and Cu zone,there is a medium changing zone,a width of 10~20nm. Its thermal expansivity and other properties are also presented and discussed.

关键词

钼铜合金/活化烧结/粉末冶金/热耗散材料

Key words

Mo-Cu alloy/active sintering/powder metallurgy/thermal management materials

分类

通用工业技术

引用本文复制引用

何忠..粉末法制取钼铜合金的微观结构[J].材料科学与工程,2000,18(4):75-77,91,4.

材料科学与工程

OACSCDCSTPCD

1673-2812

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