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首页|期刊导航|半导体学报|Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions

Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions

Li Yongliang Xu Qiuxia

半导体学报2010,Vol.31Issue(3):107-111,5.
半导体学报2010,Vol.31Issue(3):107-111,5.DOI:10.1088/1674-4926/31/3/036001

Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions

Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions

Li Yongliang 1Xu Qiuxia1

作者信息

  • 1. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
  • 折叠

摘要

关键词

HfSiON/high-k/wet etching/interracial layer

Key words

HfSiON/high-k/wet etching/interracial layer

引用本文复制引用

Li Yongliang,Xu Qiuxia..Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions[J].半导体学报,2010,31(3):107-111,5.

基金项目

Project supported by the Special Funds for Major State Basic Research Projects (No. 2006CB302704) and the National Natural Science Foundation of China (No. 60776030). (No. 2006CB302704)

半导体学报

OA北大核心CSCDCSTPCDEI

1674-4926

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