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Dummy fill effect on CMP planarity

Zhou Junxiong Chen Lan Ruan Wenbiao Li Zhigang Shen Weixiang Ye Tianchun

半导体学报2010，Vol.31Issue(10)：135-138,4.

半导体学报2010，Vol.31Issue(10)：135-138,4.DOI:10.1088/1674-4926/31/10/106003

Zhou Junxiong ¹Chen Lan ¹Ruan Wenbiao ¹Li Zhigang ¹Shen Weixiang ¹Ye Tianchun¹

作者信息

1. Institute of Microelectronics,Chinese Academy of Sciences,Beijing, 100029,China
折叠

chemical mechanical polishing/dummy fill/dishing/erosion/planarity

chemical mechanical polishing/dummy fill/dishing/erosion/planarity

Zhou Junxiong,Chen Lan,Ruan Wenbiao,Li Zhigang,Shen Weixiang,Ye Tianchun..Dummy fill effect on CMP planarity[J].半导体学报,2010,31(10):135-138,4.

Project supported by the National Major Science and Technology Special Project of China(No.2008ZX01035-001-08). （No.2008ZX01035-001-08）

OA北大核心CSCDCSTPCDEI

ISSN：1674-4926

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