粉末冶金技术2011，Vol.29Issue(1)：27-29,45,4.
真空热压制备W-50%Cu复合材料
W-50 ％ Cu composite prepared by vacuum hot-pressing
摘要
Abstract
The W-50％ Cu composite was prepared by vacuum hot-pressing and its mechanical properties were tested.Using SEM, the microstructure and fracture morphology were observed and analyzed. The results show that W-50％Cu composite with relative density of 99.6％ can be prepared under the condition of compaction pressure of 30MPa and sintering temperature of 950℃ for 2h. The microhardness, electrical conductivity and bending strength are 133HV, 68. 9％ IACS, 285MPa, respectively. The fracture mode of W-50％ Cu composite is ductile fracture,intergranular fracture is the dominant fracture behavior accompanied by a little transgranular fracture.关键词
W-50%Cu复合材料/热压/显微硬度/电导率/抗弯强度Key words
W-50％ Cu composite/ hot-pressing/ microhardness/ electrical conductivity/ bending strength引用本文复制引用
赵瑞龙,刘勇,田保红,张晓伟..真空热压制备W-50%Cu复合材料[J].粉末冶金技术,2011,29(1):27-29,45,4.基金项目
国家自然科学基金项目(50571035) （50571035）
河南科技大学博士科研启动基金项目(09001199) （09001199）
