航天器环境工程2011，Vol.28Issue(1)：56-62,7.DOI:10.3969/j.issn.1673-1379.2011.01.011
塑封微电路老炼研究综述
A review of studies of burn-in of plastic encapsulated devices
摘要
Abstract
This paper reviews the application of plastic encapsulated devices in fields requiting high reliability, and the bum-in tests to check its reliability, with emphasis on the impacts of the increase of leakage currents and parameter variations accompanied with the improvement of integration extent and processing technology, which would become crucial where stressed voltage and temperatures are applied. Therefore, it is very important to carry out thermal stability study in the burn-in tests of plastic encapsulated device in order to achieve high reliability.关键词
塑封微电路/老炼试验/热稳定性/高可靠性Key words
plastic encapsulated devices/ burn-in test/ thermal stability/ high reliability分类
信息技术与安全科学引用本文复制引用
王伟明,郝红伟,李青峰,马伯志,李路明..塑封微电路老炼研究综述[J].航天器环境工程,2011,28(1):56-62,7.基金项目
国家自然科学基金(项目编号:60906050/F040604) （项目编号:60906050/F040604）
