材料科学与工程学报2011，Vol.29Issue(3)：429-432,4.
Fe基体上Ni膜和Cu基体上Ag膜的膜内应力
Internal Stresses in Ni film on Fe Substrate and Ag film on Cu Substrate
摘要
Abstract
Ni film on Fe substrate and Ag film on Cu substrate are prepared by electroplating method. The cantilever beam method is used to measure average internal stresses of the films in situ. Distributed internal stresses in Ni and Ag films are calculated. Theoretical internal stresses are calculated using Thomas - Feimi - Dirac - Cheng (TFDC) electron theory model, which are compared with experimental results. The results show that average and distributed internal stresses in Ni films on Fe substrates are tensile stresses, while average and distributed internal stresses in Ag films on Cu substrates are pressure stresses. These internal stresses are caused by interfacial stresses. The experimental internal stresses are close to theoretical results.关键词
薄膜/内应力/悬臂梁法/电子理论Key words
films/ internal stress/ cantilever beam method/ electron theory分类
通用工业技术引用本文复制引用
王姗姗,祝要民,任凤章,赵士阳,田保红..Fe基体上Ni膜和Cu基体上Ag膜的膜内应力[J].材料科学与工程学报,2011,29(3):429-432,4.基金项目
国家自然科学基金资助项目(50771042) （50771042）
河南省基础与前沿技术研究计划资助项目(092300410064) （092300410064）
河南省科技创新人才计划资助项目(104100510005):河南省高校科技创新人才支持计划资助项目(2009HASTIT023) （104100510005）
