理化检验-物理分册2011，Vol.47Issue(3)：159-162,4.
带能谱分析的扫描电子显微镜在电子封装失效分析中的应用
Application of Scanning Electron Microscopy with Energy Dispersive Spectrometry in Failure Analysis of Electronic Packaging
方嘉1
作者信息
- 1. 上海汽车集团股份有限公司乘用车公司,上海,201804
- 折叠
摘要
Abstract
The characteristics, sample preparation methods and working modes of scanning electron microscopy (SEM) and X-ray energy dispersive spectrometry (EDS) were introduced briefly. By some examples including copper corrosion, tin whisker, silver sulfide and silver migration, the applications of SEM with EDS in failure analysis of electronic packaging were discussed.关键词
扫描电子显微镜/X射线能谱仪/电子封装/失效分析Key words
SEM/ X-ray EDS/ electronic packaging/ failure analysis分类
信息技术与安全科学引用本文复制引用
方嘉..带能谱分析的扫描电子显微镜在电子封装失效分析中的应用[J].理化检验-物理分册,2011,47(3):159-162,4.
