理化检验-物理分册2011，Vol.47Issue(3)：184-186,3.
混合电路铝腐蚀失效分析
Failure Analysis of Aluminum Corrosion of Hybrid Circuits
摘要
Abstract
The bonding failure reason of hybrid circuit was analyzed by means o physical testing and chemical analysis and simulation experiment. The results showed that contamination and hydrosphere led to aluminum corrosion in production and manufacturing process of hybrid circuit. On the basis of the failure reason. the reasonable measures to control contamination and hydrosphere were put foward.关键词
混合电路/铝腐蚀/沾污/水气Key words
hybrid circuit/ aluminum corrosion/ contamination/ hydrosphere分类
信息技术与安全科学引用本文复制引用
聂瑞霞,宋春梅..混合电路铝腐蚀失效分析[J].理化检验-物理分册,2011,47(3):184-186,3.
