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Analysis of Heat Dissipation in LED with Various Adhesives

Zi-Gui Huang Zheng-Yu Chen

热科学学报(英文版)2011,Vol.20Issue(3):254-259,6.
热科学学报(英文版)2011,Vol.20Issue(3):254-259,6.DOI:10.1007/s11630-011-0467-4

Analysis of Heat Dissipation in LED with Various Adhesives

Analysis of Heat Dissipation in LED with Various Adhesives

Zi-Gui Huang 1Zheng-Yu Chen1

作者信息

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摘要

关键词

LED heat dissipation/finite dement method/heat transfer coefficient/adhesive

Key words

LED heat dissipation/finite dement method/heat transfer coefficient/adhesive

引用本文复制引用

Zi-Gui Huang,Zheng-Yu Chen..Analysis of Heat Dissipation in LED with Various Adhesives [J].热科学学报(英文版),2011,20(3):254-259,6.

热科学学报(英文版)

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