无机材料学报2011，Vol.26Issue(4)：387-392,6.DOI:10.3724/SP.J.1077.2011.00387
CuO掺杂SrFe0.9Sno.1O3-δ负温度系数厚膜热敏电阻的电学性能
Electrical Properties of CuO-doped SrFe0.9Sn0.1O3-δ Thick Film NTC Thermistors
摘要
Abstract
CuO-doped SrFe0.9Sn0. 1O3-δ(CSFS) thick-film negative temperature coefficient (NTC) thermistors (20mol％,30mol％, 40mol％, 50mol％) were prepared by the screen printing method. The microstructures and electrical properties of CSFS thick films were determined. With the increase of CuO content, the surface morphology of thick films becomes denser. The room-temperature resistance values gradually decreases to about 0.46 MΩ and the thermistorconstant values are basically constant at around 3300 K. After the addition of CuO, SrFe0.9Sn0. 1O3-δ is decomposed into various SrFe1-xSnxO3-δ (0.1＜x＜1) phases. By two-RQ series equivalent circuit model, impedance characteristics of the thick film containing 40mol％ CuO content are investigated over the measured temperature range of 25-250℃. It is found that the total thick-film resistance is mainly attributed to the contribution of grain and grain boundary resistances, both of which show the typical NTC thermistor characteristics. Furthermore, the complete match of peak frequencies between the imaginary parts of impedance and electric modulus suggests that delocalized conduction is the main conduction mechanism in the thick-film NTC thermistors.关键词
SrFe0.9Sn0.1O3-δ/厚膜NTC热敏电阻/CuO/阻抗分析Key words
SrFe0.9Sn0.1O3-δ/ thick-film NTC thermistors/ CuO/ impedance analysis引用本文复制引用
袁昌来,巫秀芳,刘心宇,黄静月,李擘,梁梅芳,莫崇贵..CuO掺杂SrFe0.9Sno.1O3-δ负温度系数厚膜热敏电阻的电学性能[J].无机材料学报,2011,26(4):387-392,6.基金项目
国家大学生创新性实验计划资助项目(081059516) （081059516）
广西信息材料重点实验室研究基金(0710908-07-Z) （0710908-07-Z）
