华中科技大学学报（自然科学版）2011，Vol.39Issue(5)：128-132,5.
温度及加载压力对低温下固-固接触热阻的影响
Influence of temperature and pressure on solid to solid thermal contact resistance
摘要
Abstract
An experiment on copper-stainless steel was carried out by laser photothermal method (LPM).The thermal contact resistance of copper-stainless steel was measured when the temperatwre is 70～290 K and the pressure is 0.23～0.68 MPa.The experimental results show that when temperature increases the thermal contact resistance decreases at different loading pressures, and the thermal contact resistance will decrease more severely when temperature is from 70 to 100 K than from 100 to 290 K; thermal contact resistance decreases slightly when pressure increases.The regression model of contact resistane with temperature an pressure was established by regression analysis the experiment data.The relative error between experimental data and complete quadratic model is less than 10％ by fitting the experimental data, and the regression model and regression coefficient with good significant.关键词
热输运/接触热阻/激光光热法/温度/压力/模型仿真Key words
heat transfer/ thermal boundary resistance/ laser photothermal method/ temperature/loading pressure/ model simulation分类
能源科技引用本文复制引用
毕冬梅,陈焕新,王钊,王惠龄..温度及加载压力对低温下固-固接触热阻的影响[J].华中科技大学学报（自然科学版）,2011,39(5):128-132,5.基金项目
国家自然科学基金资助项目(50876034). （50876034）
