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孔挤压强化残余应力场的三维有限元模拟和实验研究

刘晓龙 高玉魁 刘蕴韬 陈东风

航空材料学报2011,Vol.31Issue(2):24-27,4.
航空材料学报2011,Vol.31Issue(2):24-27,4.DOI:10.3969/j.issn.1005-5053.2011.2.005

孔挤压强化残余应力场的三维有限元模拟和实验研究

3D Finite Element Simulation and Experimental Test on Residual Stress Field by Hole Cold Expansion

刘晓龙 1高玉魁 2刘蕴韬 1陈东风1

作者信息

  • 1. 中国原子能科学研究院,北京102413
  • 2. 北京航空材料研究院,北京100095
  • 折叠

摘要

Abstract

The residual stress field of 7050-T7451 aluminum alloy with different thickness caused by hole cold expansion was simulated by FEM using ANSYS codes. The results show that the residual compressive stress of the hole edge exists grades across the thickness and the residual compressive value is smallest at the entrance, so the entrance becomes the most weakest region. With the increment of the thickness, the residual compressive stress at the entrance increases until reaching the maximum, then decreases and gradually tends to a stable value. The residual stress of the specimen was measured by the X-ray. The results show that residual stresses are obviously less compressive on the entry surface compared to the exit surface. The measurement was consistent with the FEM simulation.

关键词

孔挤压强化/残余应力场/有限元/X射线衍射分析

Key words

hole cold expansion/ residual stress fields/ finite element/ X-ray diffraction

分类

金属材料

引用本文复制引用

刘晓龙,高玉魁,刘蕴韬,陈东风..孔挤压强化残余应力场的三维有限元模拟和实验研究[J].航空材料学报,2011,31(2):24-27,4.

基金项目

973项目(2010CB833105) (2010CB833105)

863项目(2009AA03Z535) (2009AA03Z535)

航空材料学报

OA北大核心CSCDCSTPCD

1005-5053

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