半导体学报2011，Vol.32Issue(5)：130-133,4.DOI:10.1088/1674-4926/32/5/055010
Effects of pattern characteristics on the copper electroplating process
Effects of pattern characteristics on the copper electroplating process
摘要
关键词
ULSI/electroplating/CEAC/pattern dependency/systematic variations/DFMKey words
ULSI/electroplating/CEAC/pattern dependency/systematic variations/DFM引用本文复制引用
Ruan Wenbiao,Chen Lan,Li Zhigang,Ye Tianchun,Ma Tianyu,Wang Qiang..Effects of pattern characteristics on the copper electroplating process[J].半导体学报,2011,32(5):130-133,4.基金项目
Project supported by the National Major Science and Technology Special Project of China during the 11th Five-Year Plan Period (No.2008ZX01035-001-08). （No.2008ZX01035-001-08）
