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A quasi-3-dimensional simulation method for a high-voltage level-shifting circuit structure

Liu Jizhi Chen Xingbi

半导体学报2009,Vol.30Issue(12):58-63,6.
半导体学报2009,Vol.30Issue(12):58-63,6.DOI:10.1088/1674-4926/30/12/125001

A quasi-3-dimensional simulation method for a high-voltage level-shifting circuit structure

A quasi-3-dimensional simulation method for a high-voltage level-shifting circuit structure

Liu Jizhi 1Chen Xingbi1

作者信息

  • 1. state Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
  • 折叠

摘要

Abstract

A new quasi-three-dimensional (quasi-3D) numeric simulation method for a high-voltage level-shifting circuit structure is proposed. The performances of the 3D structure are analyzed by combining some 2D device structures; the 2D devices are in two planes perpendicular to each other and to the surface of the semiconductor. In comparison with Davinci, the full 3D device simulation tool, the quasi-3D simulation method can give results for the potential and current distribution of the 3D high-voltage level-shifting circuit structure with appropriate accuracy and the total CPU time for simulation is significantly reduced. The quasi-3D simulation technique can be used in many cases with advantages such as saving computing time, making no demands on the high-end computer terminals, and being easy to operate.

关键词

quasi-3D/ 3D/ device simulation/ high-voltage level-shifting

Key words

quasi-3D/ 3D/ device simulation/ high-voltage level-shifting

分类

信息技术与安全科学

引用本文复制引用

Liu Jizhi,Chen Xingbi..A quasi-3-dimensional simulation method for a high-voltage level-shifting circuit structure[J].半导体学报,2009,30(12):58-63,6.

基金项目

Project supported by the National Natural Science Foundation of China (No. 50777005) and the Young Foundation of University of Electronic Science and Technology of China (No. JX0832). (No. 50777005)

半导体学报

OA北大核心CSCDCSTPCDEI

1674-4926

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