粉末冶金技术2009，Vol.27Issue(5)：373-376,393,5.
SPS法制备SiC_p/Cu复合材料的研究
A study on SiC_p/copper composites prepared by SPS
摘要
Abstract
In order to develop electronic packaging materials with high thermal conductivity and lower cost, SiC/ copper composites were prepared by SPS, and the influences of SiC particle size and volume fraction on the density and thermal conductivity were investigated. The results indicate that the density of composites decrease as the volume fraction increasing from 50% to 70% and as the mean diameter of SiC increasing from 14μm to 40μm. The study also indicates that the thermal conductivity is influenced by density of composite and appropriate decrease of mean diameter and volume fraction of SiC is beneficial to increase of thermal conductivity. In addition, the method of electro-less plating copper on the SiC particles was used to investigate the influence of the plated copper layer on the density and thermal conductivity of the composites. Electro-less plated copper on the SiC particles can improve the interfacial wettability between two phases. Compared with unplated SiC, the relative density is increased by 3% , thermal diffusion rate improved by 60% ,and thermal conductivity is 167W/(m · K).关键词
SPS/SiC/Cu复合材料/相对密度/热传导Key words
SPS/ SiC/copper composites/ density/ thermal conductivity分类
矿业与冶金引用本文复制引用
许彬彬,贾成厂,郭宏..SPS法制备SiC_p/Cu复合材料的研究[J].粉末冶金技术,2009,27(5):373-376,393,5.基金项目
国家高技术发展计划项目(2008AA03Z505) （2008AA03Z505）
