光学精密工程2009，Vol.17Issue(10)：2493-2498,6.
蓝宝石晶体的双面研磨加工
Dual-lapping process for sapphire crystal
摘要
Abstract
In order to achieve high efficiency and low damaged layers during a sapphire crystal lapping process,an experimental research on the rougness,lapping uniformity and sub-surface damaged layer were studied in this paper.The sapphire with (0001) orientation was lapped by 280 mesh boron carbide abrasive grits.The effects of lapping time on the material removal rates and surface roughness were investigated,and the processing remainders by the dual-lapping were determined in accordance with the surface states of the sapphire.Then micro-surface uniformity of the sapphire was also presented by using WYKO laser equipment.Finally,a nano-indentation test was carried out to measure the depth of damaged layer according to the hardness or modulus variances.Experimental results show that the sapphire crystal can offer the R,in 0.523 μm,R,<6.0 μm,the depth of heavy damaged layer of 460 nm,and the depth of sub-surface damaged layer no more than 1 μm,after it is lapped by the abrasive with 280 mesh boron carbide grits in 120 min.关键词
蓝宝石晶体/双面研磨/均匀性/亚表层损伤Key words
sapphire crystal/dual-lapping/uniformity/sub-surface damage分类
数理科学引用本文复制引用
文东辉,洪滔,张克华,鲁聪达..蓝宝石晶体的双面研磨加工[J].光学精密工程,2009,17(10):2493-2498,6.基金项目
国家重大科学研究计划资助项目(No.2006CB932607) （No.2006CB932607）
国家自然科学基金重点资助项目(No.50535040 （）
No.50705088) （）
浙江省科技计划重点资助项目(No.2007C21061) （No.2007C21061）
清华大学摩擦学国家重点实验室开放基金资助项目 （）
浙江工业大学重中之中人才基金资助项目 （）
