红外技术2009，Vol.31Issue(11)：625-627,3.
InSb半导体材料抛光研磨技术研究
Research of Polishing Technology for InSb Semiconductor Materials
向军荣 1李明华 1张磊1
作者信息
- 1. 中国空空导弹研究院光电器件研究所,河南,洛阳,471009
- 折叠
摘要
Abstract
As a low hardness and great brittleness material,InSb is hard to improve the performance of the device,which is restricted by the ability of surface processing. Mechanical technology was used for InSb surface treatment,and the influence of the concentrstion of the polishing material to the surface of InSb was analyzed.Experiments were done to optimize a good series of polishing fluid proportional parameters and goodpolishing surface of InSb.关键词
锑化铟/磨料/浓度Key words
InSb/polishing powder/concentration分类
信息技术与安全科学引用本文复制引用
向军荣,李明华,张磊..InSb半导体材料抛光研磨技术研究[J].红外技术,2009,31(11):625-627,3.
