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高性能计算机系统MGH串行背板设计

曹跃胜 李晋文 胡军

计算机工程与科学2009,Vol.31Issue(z1):5-7,13,4.
计算机工程与科学2009,Vol.31Issue(z1):5-7,13,4.DOI:10.3969/j.issn.1007-130X.2009.A1.002

高性能计算机系统MGH串行背板设计

The Design of Mlti-GigaHertz Serial-Link Backplane in High Performance Computer System

曹跃胜 1李晋文 1胡军1

作者信息

  • 1. 国防科技大学计算机学院,湖南,长沙,410073
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摘要

Abstract

The transmit rates of SERDES have approached 10 Gbps in high performance computer and telecom system,the high-end of frequency spectra in the serial links even reached over Multi-GigaHertz. This article has discussed the link method on MGH backplane. The key parameters and the application of high-performance printed circuit board (PCB) materials and backplane connectors have been presented. For achieving reliable transmission and signal integrity in the design of MGH backplane, this article proposes the angled (or zigzag) routing method, as well as the technoques of backdrilling via and dual diameter via,and these techniques have been successful applied in practical project.

关键词

背板/信号完整性/印制板材料/连接器/过孔/高速串行传输

Key words

backplane/signal integrity/PCB material/connector/via/SERDES

分类

信息技术与安全科学

引用本文复制引用

曹跃胜,李晋文,胡军..高性能计算机系统MGH串行背板设计[J].计算机工程与科学,2009,31(z1):5-7,13,4.

基金项目

国家自然科学基金资助项目(60873212) (60873212)

计算机工程与科学

OA北大核心CSCDCSTPCD

1007-130X

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