计算机工程与科学2009，Vol.31Issue(z1)：120-124,5.DOI:10.3969/j.issn.1007-130X.2009.A1.034
龙芯3A处理器封装的散热设计
Based on Longson3A Processor Package Heat Dissipation Design
摘要
Abstract
With the microprocessor performance becomes more and more high, the processor package become a critical issue in processor applications. A high-quality package can not only protect processor IC from electrostatic interference, moisture environment, but also transform the heat to outside air generated by processor. This paper proposes a package solution to Loongson3A processor. It analyzes the requirement of Loongson3A and chooses FC-BGA1121 package for Loongson3A to solve the heat dissipation issue.关键词
龙芯3A/封装/FC-BGA/散热Key words
Longson3A/package/FC-BGA/heat dissipation分类
信息技术与安全科学引用本文复制引用
张瑾,王剑..龙芯3A处理器封装的散热设计[J].计算机工程与科学,2009,31(z1):120-124,5.基金项目
国家863计划资助项目(2008AA110901) （2008AA110901）
国家973计划资助项目(2005CB321600) （2005CB321600）
国家自然科学基金资助项目(60603049) （60603049）
北京市自然科学基金资助项目(4072024) （4072024）
