光学精密工程2011，Vol.19Issue(7)：1612-1619,8.DOI:10.3788/OPE.20111907.1612
用扫描白光干涉术检测合金韧窝断口微观三维形貌
Measurement of microscopic surface topography of alloy dimple fracture by scanning white-light interferometry
摘要
Abstract
Scanning White-light Interferometry (SWLI) was proposed to measure the complex microscopic surface topography of a dimple fracture of 30CrMnSiA alloy. The Linnik structure was adopted in the system and the 3D image of the dimple fracture was rebuilt by the cosine Fourier analysis algorithm. Experiments show that the longitudinal measuring accuracy is better than 5 nm for a scan range of 120 μm. The cosine Fourier analysis offers strong abilities of phase extraction and noise suppression, and an ideal 3D reconstruction image of the dimple fracture is obtained. The obtained surface data were tested for fractal dimension by a slit island method. At incised height from 40％ to 70％, the fractal dimension values range from 1. 630 4 to 1. 643 2 with an average of 1. 641 7 and the standard deviation of 0. 012 0, which indicates that the dimple fracture of 30CrMnSiA has a typical fractal character. In conclusion, the SWLI is an effective way to measure the microscopic 3-D fracture surface topography,and it is characterized by high longitudinal precision, long dynamic measuring range and high reconstruction efficiency.关键词
扫描白光干步/合金韧窝断口/空间频域/微观三维形貌Key words
scanning white-light interferometry / alloy/ dimple fracture/ spatial frequency domain/ microscopic 3-D profile分类
数理科学引用本文复制引用
邹文栋,黄长辉,郑玱 ,徐周珏,董娜..用扫描白光干涉术检测合金韧窝断口微观三维形貌[J].光学精密工程,2011,19(7):1612-1619,8.基金项目
航空科学基金资助项目(No.20085656018) （No.20085656018）
