真空电子技术Issue(3)：55-58,61,5.
真空电子器件用Ga基堵漏钎料的研究
Study of Ga-Based Brazing Fillers in Stockage of Vacuum Electronic Devices
李海涛 1曲文卿 1庄鸿寿1
作者信息
- 1. 北京航空航天大学,机械工程及自动化学院,北京,100191
- 折叠
摘要
Abstract
This paper successfully developed three kinds of brazing fillers of OFHC vacuum electronic devices.The interface connection was analyzed by scanning electron microscopy and asperses X-ray spectrometry.The diffusive behaviors were studied at different diffusion temperature.The results show that,three kinds of fillers can achieve satisfied interdiffusion effect with OFHC.The inter-diffusion effect of Ga15In solder is best in three kinds, and the Ga-15In solder get the best effect at 650℃.关键词
真空电子器件/扩散钎焊/镓基钎料/无氧铜Key words
Vacuum electronic devices/ Diffusing brazing/ Ga-based brazing fillers/ OFHC分类
矿业与冶金引用本文复制引用
李海涛,曲文卿,庄鸿寿..真空电子器件用Ga基堵漏钎料的研究[J].真空电子技术,2011,(3):55-58,61,5.
