华中科技大学学报（自然科学版）2011，Vol.39Issue(6)：87-90,4.
基于空气耦合超声激励的倒装芯片缺陷检测
Fault detection of flip chip by using air-coupled ultrasound excitation
摘要
Abstract
Based on the vibration model of flip chip (FC), a fault detection principle using the change of FC natural frequency was investigated. The first 5 order vibration modes of FCs with peripheral bumping solder were analyzed using COMSOL Multiphysics software. The simulation result shows that solder bumping missing can lead to the significant change for high order natural frequencies. A fault detection method of FC was proposed based on air-coupled ultrasound excitation. By measuring the vibration velocity of FC, the first 5 frequencies of defective FCs were extracted. The measurement results agree with the simulation ones, which validates the feasibility of the defect inspection method.关键词
空气耦合/超声激励/倒装芯片/固有频率/缺陷检测Key words
air-coupled/ ultrasound excitation/ flip chip (FC)/ natural frequency/ fault detection分类
信息技术与安全科学引用本文复制引用
廖广兰,张学坤,于龙,史铁林..基于空气耦合超声激励的倒装芯片缺陷检测[J].华中科技大学学报（自然科学版）,2011,39(6):87-90,4.基金项目
国家重点基础研究发展计划资助项目(2009CB724204) （2009CB724204）
国家自然科学基金资助项目(50805061,50975106). （50805061,50975106）
