| 注册
首页|期刊导航|半导体学报|A new high voltage SOILDMOS with triple RESURF structure

A new high voltage SOILDMOS with triple RESURF structure

Hu Xiarong Zhang Bo Luo Xiaorong Yao Guoliang Chen Xi Li Zhaoji

半导体学报2011,Vol.32Issue(7):42-45,4.
半导体学报2011,Vol.32Issue(7):42-45,4.DOI:10.1088/1674-4926/32/7/074006

A new high voltage SOILDMOS with triple RESURF structure

A new high voltage SOILDMOS with triple RESURF structure

Hu Xiarong 1Zhang Bo 1Luo Xiaorong 1Yao Guoliang 1Chen Xi 1Li Zhaoji1

作者信息

  • 1. State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
  • 折叠

摘要

Abstract

A novel triple RESURF (T-resurf) SOILDMOS structure is proposed.This structure has a P-type buried layer.Firstly,the depletion layer can extend on both sides of the P-buried layer,serving as a triple RESURF and leading to a high drift doping and a low on-resistance.Secondly,at a high doping concentration of the drift region,the P-layer can reduce high bulk electric field in the drift region and enhance the vertical electric field at the drain side,which results in uniform bulk electric field distributions and an enhanced BV.The proposed structure is used in SOI devices for the first time.The T-resurf SOILDMOS with BV =315 V is obtained by simulation on a 6 μm-thick SOI layer over a 2 μm-thick buried oxide layer,and its Rsp is reduced from 16.5 to 13.8 mΩ.cm2 in comparison with the double RESURF (D-resurf) SOILDMOS.When the thickness of the SOI layer increases,T-resurf SOILDMOS displays a more obvious effect on the enhancement of BV2/Ron.It reduces Rsp by 25% in 400 V SOILDMOS and by 38% in 550 V SOI LDMOS compared with the D-resurf structure.

关键词

SOILDMOS/double resurf/triple resurf/REBULF/breakdown voltage

Key words

SOILDMOS/double resurf/triple resurf/REBULF/breakdown voltage

引用本文复制引用

Hu Xiarong,Zhang Bo,Luo Xiaorong,Yao Guoliang,Chen Xi,Li Zhaoji..A new high voltage SOILDMOS with triple RESURF structure[J].半导体学报,2011,32(7):42-45,4.

基金项目

Project supported by the National Natural Science Foundation of China (Nos.60806025,60976060). (Nos.60806025,60976060)

半导体学报

OACSCDCSTPCDEI

1674-4926

访问量0
|
下载量0
段落导航相关论文