电焊机2011，Vol.41Issue(7)：79-84,6.
复配表面活性剂对无铅助焊剂润湿性能影响的研究
Effect of the surfactants in flux on wettability of lead-free solder
摘要
Abstract
Surfactant plays a great role in reducing the surface tension of the melting lead-free solder and increasing the wettability of the lead-free solder on base metal.Four different types of surfactants were selected in accordance with HLB values and molecular weights.The flux used for the study of the effect of surfactants on wettability of lead-free solder was composed of anhydrous ethanol as solvent, organic acids as active moiety, selected surfactants, and some other components such as film formers, corrosion inhibitor, etc. The results of the wetting power tests and spread tests showed that the types and contents of surfactants in flux had a rather obvious influence on the wettability of lead-free solder.It was found that the flux with properly combined surfactants had improved properties.关键词
表面活性剂/无铅钎料/助焊剂/润湿性能Key words
surfactant/lead-free solder/flux/wettability分类
矿业与冶金引用本文复制引用
郑家春,杨晓军,雷永平,夏志东,郭福..复配表面活性剂对无铅助焊剂润湿性能影响的研究[J].电焊机,2011,41(7):79-84,6.基金项目
“十一五”国家科技支撑重点资助项目“含有毒有害材料元素材料替代技术”(2006BAE03802) （2006BAE03802）
