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Thermal Conductivity Behavior of Carbon Nanotubes Reinforced Copper Matrix Composites

CHU Ke GUO Hong JIA Cheng-chang YIN Fa-zhang ZHANG Xi-min HAN Yuan-yuan FAN Ye-ming

材料工程Issue(z1)：277-281,5.

Thermal Conductivity Behavior of Carbon Nanotubes Reinforced Copper Matrix Composites

CHU Ke ¹GUO Hong ¹JIA Cheng-chang ¹YIN Fa-zhang ¹ZHANG Xi-min ¹HAN Yuan-yuan ¹FAN Ye-ming¹

作者信息

折叠

摘要

关键词

carbon-nanotube/copper composites/spark plasma sintering/thermal conductivity/interfacial thermal resistance

Key words

carbon-nanotube/copper composites/spark plasma sintering/thermal conductivity/interfacial thermal resistance

引用本文复制引用

CHU Ke,GUO Hong,JIA Cheng-chang,YIN Fa-zhang,ZHANG Xi-min,HAN Yuan-yuan,FAN Ye-ming..Thermal Conductivity Behavior of Carbon Nanotubes Reinforced Copper Matrix Composites[J].材料工程,2010,(z1):277-281,5.

基金项目

This work was financially supported by National Natural Science Fund of China (No.50971020) and National 863 Plan Project of China (No.2008AA03Z505). （No.50971020）

材料工程

OA北大核心CSCDCSTPCD

ISSN：1001-4381

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