真空电子技术Issue(4)：42-45,59,5.
金属化层表面状况的不同处理方法对陶瓷金属封接强度的影响
Influence of Different Surface Proceeding Methods of the Metallization Layer on the Ceramic-Metal Sealing Intensity
张振霞 1李秀霞 1韩勇 1林毅1
作者信息
- 1. 中国科学院电子学研究所中国科学院高功率微波源与技术重点实验室,北京100190
- 折叠
摘要
Abstract
Two surface proceeding methods, the polishing method and the pickling method, have employed to treat the surface state of the ceramic metallization layer. The binding forces of the electrodeposit-ed nickel layer treated with different proceeding methods have been analyzed and compared by scratch test. Several tensile tests have been performed to study the sealing intensity of the ceramic tensile test piece treated with different proceeding methods. The results show that better metallization surface state could be obtained with the pickling method, which is verified to be an effective and feasible method for improving the ceramic-metal sealing intensity.关键词
陶瓷金属封接/金属化层/表面状态:结合力/封接强度Key words
Ceramic-metal sealing, Metallization layer, Surface state, Binding force, Sealing intensity分类
通用工业技术引用本文复制引用
张振霞,李秀霞,韩勇,林毅..金属化层表面状况的不同处理方法对陶瓷金属封接强度的影响[J].真空电子技术,2011,(4):42-45,59,5.
