半导体学报2011,Vol.32Issue(10):49-52,4.DOI:10.1088/1674-4926/32/10/104004
Ultra-low specific on-resistance SOI double-gate trench-type MOSFET
Ultra-low specific on-resistance SOI double-gate trench-type MOSFET
摘要
Abstract
An ultra-low specific on-resistance (Ron,sp) silicon-on-insulator (SOI) double-gate trench-type MOSFET (DG trench MOSFET) is proposed.The MOSFET features double gates and an oxide trench:the oxide trench is in the drift region,one trench gate is inset in the oxide trench and one trench gate is extended into the buried oxide.Firstly,the double gates reduce Ron,sp by forming dual conduction channels.Secondly,the oxide trench not only folds the drift region,but also modulates the electric field,thereby reducing device pitch and increasing the breakdown voltage (BV).A BV of 93 V and a Ron,sp of 51.8 mΩ·mm2 is obtained for a DG trench MOSFET with a 3 μm half-cell pitch.Compared with a single-gate SOI MOSFET (SG MOSFET) and a single-gate SOI MOSFET with an oxide trench (SG trench MOSFET),the Ron,sp of the DG trench MOSFET decreases by 63.3% and 33.8% at the same BV,respectively.关键词
double gates/ trench/ specific on-resistance/ breakdown voltageKey words
double gates/ trench/ specific on-resistance/ breakdown voltage引用本文复制引用
Lei Tianfei,Luo Xiaorong,Ge Rui,Chen Xi,Wang Yuangang,Yao Guoliang,Jiang Yongheng,Zhang Bo,Li Zhaoji..Ultra-low specific on-resistance SOI double-gate trench-type MOSFET[J].半导体学报,2011,32(10):49-52,4.基金项目
Project supported by the National Natural Science Foundation of China (Nos.60806025,60976060),the National Key Laboratory of Analogy Integrated Circuit (No.9140C090304110C0905),and the State Key Laboratory of Electronic Thin Films and Integrated Devices,China (No.CXJJ201004). (Nos.60806025,60976060)