电源技术2011，Vol.35Issue(10)：1281-1284,4.
ATX电源中功率半导体元件散热技术研究
Research of heat dissipation technology in power semiconductor devices of PC ATX power
摘要
Abstract
The heating temperature of semi-conductor devices among three kinds of ATX powers in the same condition was investigated in this paper, the power consumption was calculated, and the different heat dispersion was contrasted. The results show that compared with the traditional thermal module, the heat pipe thermal power solves the thermal problem with the heat pipes and fans and greatly improves the reliability. It was particularly applied in high power supply and the Sever. At last, the heat of different ATX powers with Icepak was simulated in the paper. The simulation results show a good agreement with the measure data.关键词
ATX电源/半导体器件/微热管散热/模拟分析Key words
ATX power/semiconductor device/heat pipe sinks/simulation and analysis分类
信息技术与安全科学引用本文复制引用
陈镇宇,李勇,曾志新,欧元贤..ATX电源中功率半导体元件散热技术研究[J].电源技术,2011,35(10):1281-1284,4.基金项目
国家自然科学基金(50705031,50975096) （50705031,50975096）
