计算技术与自动化2011，Vol.30Issue(3)：95-99,5.
SMT锡膏检测中基于Delphi与OpenGL的锡膏三维显示
3D Demonstration of Solder Paste Based on Delphi and OpenGL in SMT Solder Paste Inspection
摘要
Abstract
In this paper, a method about how to program in Delphi with OpenGL to demonstrate the 3D shape of solder paste is presented. It also realizes some functions such as rotating, scaling and displaying different color according to the thickness of solder paste. Experimental results show that programming in Delphi with OpenGL to demonstrate the 3D shape of solder paste dynamically can not only avoid a lot of matrix operation, reduce the length of the program code, enhance the efficiency of programming, but also improve the demonstration effect of graphics.关键词
OpenGL/Delphi/双缓存技术/锡膏三维模型Key words
OpenGL/ Delphi/ swap buffers/ 3D solder paste model分类
信息技术与安全科学引用本文复制引用
马勇平,章云,罗兵..SMT锡膏检测中基于Delphi与OpenGL的锡膏三维显示[J].计算技术与自动化,2011,30(3):95-99,5.基金项目
教育部广东省产学研项目(2010B090400026) （2010B090400026）
