半导体学报2011，Vol.32Issue(3)：140-144,5.DOI:10.1088/1674-4926/32/3/036002
Model analysis and experimental investigation of the friction torque during the CMP process
Model analysis and experimental investigation of the friction torque during the CMP process
摘要
Abstract
A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented,and the friction force and torque detection experiments during the CMP process are carried out to verify the model.The results show that the model can well describe the feature of friction torque during CMP processing.The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.关键词
CMP/ friction torque/ endpoint detectionKey words
CMP/ friction torque/ endpoint detection引用本文复制引用
Guo Dongming,Xu Chi,Kang Renke,Jin Zhuji..Model analysis and experimental investigation of the friction torque during the CMP process[J].半导体学报,2011,32(3):140-144,5.基金项目
Project supported by the Joint Fund of NSFC with Guangdong Province,China (No.U0734008) and the National Science and Technology Major Project of China (No.2009ZX02011). （No.U0734008）
