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首页|期刊导航|半导体学报|Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Li Zhicong Wang Guohong Li Jinmin Li Panpan Wang Bing Li Hongjian Liang Meng Yao Ran Li Jing Deng Yuanming Yi Xiaoyan

半导体学报2011,Vol.32Issue(11):69-71,3.
半导体学报2011,Vol.32Issue(11):69-71,3.DOI:10.1088/1674-4926/32/11/114007

Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Li Zhicong 1Wang Guohong 1Li Jinmin 1Li Panpan 1Wang Bing 1Li Hongjian 1Liang Meng 1Yao Ran 1Li Jing 1Deng Yuanming 2Yi Xiaoyan1

作者信息

  • 1. Semiconductor Lighting R & D Center应 Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 2. yangzhou Zhongke Semiconductor Lighting Company, Yangzhou 225009, China
  • 折叠

摘要

Abstract

Through insertion of an AlGaN/GaN stack between the u-GaN and n-GaN of GaN-based light-emitting diodes (LEDs),the strain in the epilayer was increased,the dislocation density was reduced.GaN-based LEDs with different Al compositions were compared.6.8% A1 composition in the stacks showed the highest electrostatic discharge (ESD) endurance ability at the human body mode up to 6000 V and the pass yield exceeded 95%.

关键词

A1GaN/GaN stacks/ light-emitting diodes/ dislocation density/ ESD

Key words

A1GaN/GaN stacks/ light-emitting diodes/ dislocation density/ ESD

引用本文复制引用

Li Zhicong,Wang Guohong,Li Jinmin,Li Panpan,Wang Bing,Li Hongjian,Liang Meng,Yao Ran,Li Jing,Deng Yuanming,Yi Xiaoyan..Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer[J].半导体学报,2011,32(11):69-71,3.

基金项目

Project supported by the National High Technology Research and Development Program of China (No.2008AA03A 197). (No.2008AA03A 197)

半导体学报

OACSCDCSTPCDEI

1674-4926

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