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TO-220FS封装产品的研发和制造

张华洪 鄢胜虎

电子与封装2011,Vol.11Issue(8):40-42,3.
电子与封装2011,Vol.11Issue(8):40-42,3.

TO-220FS封装产品的研发和制造

TO-220FS Production Development and Manufacture

张华洪 1鄢胜虎1

作者信息

  • 1. 汕头华汕电子器件有限公司,广东汕头515300
  • 折叠

摘要

Abstract

This document analyzes the TO-220FS packaged product internal features,in-depth study in comparing the traditional features of the internal structure of the whole encapsulation products.It introduces products and processes that occur to meet a variety of technical difficulty,and take appropriate measures to successfully address these problems by cause analysis.And according to product structure problem-solving at the same time,the document also gives the TO-220FS process conditions,technology,equipment renewal of the technical points in mass production,It solves the problem of the pinhole,deruner,less combine for plating,tendon pull in trimming process,isolation testing etc.,after reading this document and applying the technology,the mass production can be successfully realized,the assembly technology can be reached the international advanced level of technology,product quality is steady,and customer can be very satisfied.

关键词

针孔/镀层结合力/拉筋/绝缘测试

Key words

pinhole/combine for plating/tendon pull/ISO test

分类

信息技术与安全科学

引用本文复制引用

张华洪,鄢胜虎..TO-220FS封装产品的研发和制造[J].电子与封装,2011,11(8):40-42,3.

电子与封装

1681-1070

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