电子器件2011，Vol.34Issue(6)：641-644,4.DOI:10.3969/j.issn.1005-9490.2011.06.010
隔层不交叠多层电感分析与设计
The Analysis and Design of Non-Overlapping Multi-Layer Inductor
摘要
Abstract
An on-chip spiral inductor with non-overlapping structure has been presented. Its manufacturing process is compatible with the standard CMOS multi-layer process. Based on the lumped model of the spiral inductor,the proposed inductor has been simulated using HFSS. At the same time, performance comparisons between the proposed inductor and the traditional multi-layer inductor have been carried out with the same process parameters. Simulation results show that the proposed achieve an increase of 3.5% for the maximum quality factor,an increase of 65% for the BW,and an increase of 127% for the self resonance frequency. Meanwhile,the inductance frequency range of maximum quality factor is around several nH,and can meet the requirement of most RF circuits.关键词
多层电感/品质因子/HFSS仿真/损耗Key words
multi-layer inductor/quality factor/HFSS simulation/loss分类
信息技术与安全科学引用本文复制引用
祝文韬,李小进,蔡静,胡少坚,王勇,李曦,石艳玲..隔层不交叠多层电感分析与设计[J].电子器件,2011,34(6):641-644,4.基金项目
国家重大科技专项(2009ZX02023-2-1) （2009ZX02023-2-1）
上海市科委启明星计划(09QB1402000) （09QB1402000）
