物理学报2011，Vol.60Issue(11)：675-680,6.
考虑硅通孔的三维集成电路热传输解析模型
An analytical thermal model for 3D integrated circuit considering through silicon via
摘要
Abstract
Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via （TSV）,the equivalent thermal model for TSV is presented in this paper.And then,the corresponding analytical thermal model with considering TSV is deriveed.Finally,Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration.The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits,and the increase of TSVs＇s pitch can raise the temperature of the 3D IC circuit.关键词
三维集成电路/热管理/硅通孔/等效热模型Key words
3D IC/thermal management/through silicon via/equivalent thermal model分类
信息技术与安全科学引用本文复制引用
朱樟明,左平,杨银堂..考虑硅通孔的三维集成电路热传输解析模型[J].物理学报,2011,60(11):675-680,6.基金项目
国家自然科学基金 （）
国家重大科技专项 （）
国家重点实验室基金 （）
西安AM创新基金（批准号：XA-AM-200907）资助的课题 （）
